Amkor Technology Expands U.S. Advanced Packaging Footprint
“Arizona represents a major step forward in expanding advanced semiconductor manufacturing capacity in the United States,” Engel said
Amkor Technology has reaffirmed its commitment to expanding advanced semiconductor packaging and testing capacity in the United States through continued investment in its growing Arizona manufacturing campus.
The company announced it has secured an additional 67-acre parcel adjacent to its existing 104-acre site within Peoria’s Innovation Core, creating further room for future development as demand for advanced semiconductor technologies accelerates.
The expansion forms part of Amkor’s broader strategy to establish one of the most significant advanced packaging and test operations in the US. The Arizona campus is expected to become the country’s first high-volume advanced packaging outsourced semiconductor assembly and test (OSAT) facility, supporting critical applications across artificial intelligence, high-performance computing, automotive technologies and next-generation communications.
Kevin Engel, President and Chief Executive Officer of Amkor Technology, said the investment marks another important milestone in strengthening domestic semiconductor manufacturing capabilities.
“Amkor’s investment in Arizona represents a major step forward in expanding advanced semiconductor manufacturing capacity in the United States,” Engel said. “Our continued growth in Arizona enhances our ability to deliver leading-edge packaging and test solutions for customers while supporting a more resilient and secure global semiconductor supply chain.”
The campus is designed to provide large-scale, state-of-the-art packaging and testing capabilities for increasingly complex semiconductor devices, particularly as AI-driven computing demand continues to grow globally.
Headquartered in the United States, Amkor is the world’s largest US-based OSAT provider and a global leader in outsourced semiconductor packaging and test services. The company supports many of the world’s leading semiconductor and electronics firms through a portfolio that includes advanced packaging, wafer-level processing and system-in-package technologies.
Its solutions are widely used in smartphones, AI infrastructure, automotive electronics, data centres and wearable devices.
The additional land acquisition provides Amkor with long-term strategic flexibility as semiconductor manufacturers increasingly seek advanced packaging capacity closer to major US technology customers and fabrication facilities.
The expansion also aligns with broader efforts across the US to strengthen domestic semiconductor manufacturing and reduce supply chain vulnerabilities through increased investment in critical chip infrastructure.
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