German water treatment plant suppoting Semiconductor manufacturing.


The contract value is in the three-digit million euro range

HOCHTIEF has secured a major contract from SachsenEnergie to design and build a new river water treatment facility in Dresden, Germany, aimed at strengthening industrial water supply for the region’s growing semiconductor industry.

The facility will extract and process water from the Elbe River and is expected to begin supplying industrial users from 2030. The project will support Dresden’s position as one of Europe’s most important semiconductor hubs, where global chip manufacturers and technology companies are expanding production capacity.

The contract value is in the three-digit million euro range and forms part of HOCHTIEF’s strategy to expand its presence in high-growth sectors including semiconductors, energy infrastructure and sustainable industrial development.

“This project highlights our focus on future-oriented markets where advanced infrastructure is essential,” said Juan Santamaría. “By integrating engineering, construction and operational expertise, we are helping secure reliable industrial water resources while supporting the sustainable growth of a key European technology cluster.”

The project will follow a two-stage delivery model. HOCHTIEF will initially lead the design phase, scheduled for completion in April 2028. Construction is planned to begin in mid-2027, followed by a year-long commissioning period and a multi-year maintenance agreement.

The turnkey development will include civil construction, process engineering and advanced plant systems. Once operational, the facility will become a central supplier of industrial-grade water for semiconductor manufacturers in the Dresden region.

Reliable access to high-quality water is becoming increasingly critical for semiconductor production, where fabrication processes require large volumes of precisely treated water. The new Dresden facility will therefore play an important role in supporting Europe’s ambitions to expand domestic chip manufacturing capacity and strengthen supply chain resilience.

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