Taiwan’s First 12-Inch Semiconductor R&D Facility
Taiwan Premier Cho Jung-tai highlighted that major industry players — including TSMC, United Microelectronics Corporation (UMC), Vanguard International Semiconductor, Powerchip Semiconductor
Taiwan Breaks Ground on Nation’s First 12-Inch Semiconductor R&D Facility
Taiwan has officially commenced construction of a major new Advanced Semiconductor Research & Development Center — home to the nation’s first government-sponsored 12-inch (300 mm) semiconductor pilot line — marking a significant step in bolstering the island’s chip innovation ecosystem and global competitiveness.
A Strategic Milestone for Taiwan’s Chip Industry
The groundbreaking ceremony took place on February 10, 2026, at the Industrial Technology Research Institute (ITRI) campus in Hsinchu, a region long known as the heart of Taiwan’s semiconductor industry. The project, supported under the government’s IC Taiwan initiative, brings together the Ministry of Economic Affairs (MOEA), National Development Council, and the National Science and Technology Council.
With a total investment of NT$3.772 billion (about US $120 million), the facility is expected to be completed by December 2027, with phased operations beginning in the first quarter of 2028.
Infrastructure and Capabilities
The Advanced Semiconductor R&D Center will house Taiwan’s first 12-inch advanced pilot production line — equipped for back-end-of-line (BEOL) R&D and pilot production processes (28 nm–90 nm) — designed to drastically shorten development cycles by about 30 % for domestic chip developers.
The facility’s mission will focus on three major pillars:
Innovation and trial production for IC design verification
Advanced semiconductor process development
Localized equipment and materials validation
This structure aims to bridge research and commercialization gaps for startups and smaller design firms by lowering entry barriers and enabling faster product iteration.
Industry Participation and Support
In remarks at the event, Taiwan Premier Cho Jung-tai highlighted that major industry players — including TSMC, United Microelectronics Corporation (UMC), Vanguard International Semiconductor, Powerchip Semiconductor, and others — participated in the ceremony, reflecting broad industrial support for the initiative.
TSMC, Taiwan’s largest contract chip maker, has also contributed by donating three pieces of advanced 12-inch semiconductor R&D equipment and providing technical guidance for plant design and construction.
Global Landscape: Similar R&D & Pilot Facilities
Taiwan’s new pilot line comes amid a broader global trend of governments and research ecosystems investing in semiconductor R&D infrastructure — particularly 300 mm (12-inch) pilot lines that serve as innovation platforms before full commercial fabs.
NanoIC Pilot Line (Belgium & EU): As part of the European Chips Act, Europe has built a 300 mm pilot facility dubbed the NanoIC Pilot Line to focus on advanced logic, memory, and interconnect technologies beyond 2 nm. With an estimated €2.5 billion investment, the NanoIC line aims to accelerate commercialization of cutting-edge semiconductor technologies for computing, communications, automotive and energy sectors.
In the US, Universities and states are also building pilot manufacturing and R&D centers with 300 mm capabilities, such as the recently announced Texas A&M’s semiconductor institute planned for ~2028.
Strengthening Taiwan’s Innovation Ecosystem
The new center aligns with broader efforts to solidify Taiwan’s semiconductor leadership and cultivate a dense innovation ecosystem. By integrating modern 12-inch R&D capabilities with existing 8-inch pilot lines, Taiwan aims to provide a seamless one-stop platform as part of its IC Taiwan initiative — from design through testing, packaging, and manufacturing.
Beyond shortening product development times, the facility is expected to:
Support next-generation technologies including AI chips, silicon photonics, and quantum technologies
Offer domestic equipment and material suppliers a venue to demonstrate and validate products
Strengthen supply chain resilience and enhance the nation’s technological self-sufficiency
Cultivate high-level technical talent for future chip innovation cycles
A Long-Term Vision for Global Leadership
Officials and industry leaders alike view this project as a foundational piece of Taiwan’s semiconductor strategy — not just for economic growth but as a platform to maintain global leadership amid increasing competition and technological complexity.
By lowering barriers for new entrants, fostering collaboration between government, academia, and industry, and positioning Taiwan at the forefront of pilot chip development, the Advanced Semiconductor R&D Center represents both a technological and strategic investment in the future of the semiconductor era.
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