TSMC to Break Ground on 1.4nm “A14” Fab
TSMC to Break Ground on 1.4nm “A14” Fab
Taiwan Semiconductor Manufacturing Company (TSMC), the world’s leading semiconductor foundry, today announced plans to break ground on its new 1.4 nanometer (A14) fabrication facility in Taichung, Taiwan, on November 5, 2025. The groundbreaking marks a major milestone in TSMC’s ongoing roadmap toward next-generation logic technologies for high-performance computing and artificial intelligence applications.
The new fab—located in the Central Taiwan Science Park (CTSP) and internally designated as Fab 25—represents a total investment of approximately NT$1.5 trillion (US $49 billion). Construction will begin immediately following the ceremony, with risk production scheduled for 2027 and mass production targeted for the second half of 2028.
“The A14 process node will define the next era of computing performance and energy efficiency,” said Dr. C.C. Wei, CEO of TSMC. “This new fab in Taichung demonstrates our commitment to advancing semiconductor technology while strengthening Taiwan’s position at the center of global chip innovation.”
The A14 node is the direct successor to the N2 platform and introduces up to 15% higher performance at the same power or up to 30% lower power at the same performance, with a 20% increase in logic density.
It will also debut NanoFlex Pro, TSMC’s enhanced nanosheet transistor architecture, enabling superior power, performance, and area (PPA) scaling optimized for AI accelerators, data-center processors, and flagship mobile devices.
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