Project Profile
Intel Ohio
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$1.1
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100
The building of any semiconductor manufacturing facility is a multi-year project. After serious consideration for site selection is completed, concept and layout design are done, the general contractor is onboarded, the early supply chain is established, early enabling materials have been bought, permits are in place, site remediation is done, and waste management systems are in place, the work can finally begin. And then things can move fast!
Intel Ohio is an example of such a project. One year on the project has dramatically progresses. Storm water systems are in place, site excavation is well and truly progressed and concrete pours are in progress. The decision to invest in an onsite concrete processing plant has yielded great dividends for the site.
To date approximately 500 workers are onsite but this is expected to grow to a staggering 7000 at peak build.
Additional support works, such as the external road infrastructure, are being progressed in part due to grants provided by the state of Ohio and the overall development of the Licking County area to support the project is on track.
Intel have set aside approximately 250 acers of land for suppliers to build their support facilities on site. This again shows the amount of preplanning put into the development of the site.
In summary, it appears that good progress is being made at the Ohio Facility. With Mass excavation and concrete pouring in flight, the project would be considered to be on track. Early announcements from Intel indicated that the first silicon wafers (the wafers that qualify for the facility) would be manufactured in 2025. To meet this deadline, 2024 and H1 2025 will be very busy for the project as the Site support facilities, the manufacturing facility and the fit out must all occur for the first silicon to be processed.
More progress updates will be published regularly.
Sources: The Columbus Dispatch & Intel press releases.