ESMC - event at Dresden fab site
Joint venture between TSMC (70% stake), Robert Bosch, Infineon Technologies, and NXP Semiconductors
European Semiconductor Manufacturing Company (ESMC) has marked a major construction milestone at its semiconductor fab in Dresden, holding a topping-out ceremony for its new office buildings. The event, announced via LinkedIn, celebrated the installation of the final structural beam on the central office building.
Christian Koitzsch, President of ESMC, said the company is pleased with the steady progress of the project to date. Construction will now move to the next phase, including façade installation and interior fit-out across the three office buildings, which will serve as the company’s headquarters and a hub for customer engagement.
ESMC — a joint venture between TSMC (70% stake), Robert Bosch, Infineon Technologies, and NXP Semiconductors (10% each) — officially broke ground on the Dresden fab in August 2024. The project has secured approval under EU state aid rules, including a €5 billion German government support package. Total investment is expected to exceed €10 billion, funded through a mix of equity, debt financing and public support.
Once operational, the facility is designed to manufacture up to 40,000 300mm wafers per month. It will utilise 28/22nm planar CMOS and 16/12nm FinFET process technologies, strengthening Europe’s advanced semiconductor production capabilities and making it the continent’s first FinFET-capable fab.
Production is scheduled to begin in 2027. The project is expected to create approximately 2,000 direct high-tech jobs, with additional employment generated across the broader European semiconductor supply chain.
The topping-out ceremony represents a significant step forward in Europe’s efforts to expand domestic chip manufacturing capacity and reinforce its position in the global semiconductor industry.
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