Micron Announces New York Megafab
Micron announces that it will officially break ground on its $100bn megafab project in Onondaga County, Central New York, on January 16, 2026.
Micron Technology is set to mark a major milestone in US manufacturing with the start of construction on what will be the largest semiconductor facility in the country’s history. The company announced that it will officially break ground on its $100bn megafab project in Onondaga County, Central New York, on January 16, 2026.
Following a comprehensive environmental review and the securing of all required permits, Micron is now ready to begin site preparation and construction. Representing the largest private investment ever made in New York state, the development will house the world’s most advanced memory manufacturing capabilities and is designed to support the rapidly growing demands of AI-driven systems. Once complete, the site is expected to include up to four fabrication plants, making it the largest semiconductor manufacturing complex in the United States.
Micron chairman, president and CEO Sanjay Mehrotra will be joined at the groundbreaking by senior company executives alongside representatives from the Trump administration, members of Congress, and state and local officials. Business leaders and community representatives will also attend. The ceremony will be followed by a celebratory event at Syracuse University’s National Veterans Resource Center, where executives and public officials will deliver remarks.
Describing the project as a defining moment, Mehrotra said the New York megafab underscores the importance of US leadership in advanced semiconductors as the global economy moves deeper into the AI era. He added that the investment reinforces Micron’s position as the only US-based manufacturer of memory chips.
Micron is a global leader in memory and storage technologies, producing high-performance DRAM, NAND and NOR solutions that power applications ranging from data centres to mobile devices and the intelligent edge.
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