Peter O’Brien (Tyndall) awarded for help develop chip sector
Peter O’Brien was recognised for his leadership in photonics-electronic packaging
Peter O’Brien has been awarded the 2025 SEMI European Award, recognising his significant contributions to global semiconductor innovation.
A leading photonics expert at the Tyndall National Institute, based at University College Cork, O’Brien currently heads research in photonics packaging and systems integration. The award, presented by SEMI—the global industry association representing the semiconductor and electronics supply chain—honours individuals whose work has had a lasting impact on the industry worldwide.
O’Brien was recognised for his leadership in photonics-electronic packaging, his role in advancing Europe’s semiconductor pilot lines, and his commitment to developing specialised training programmes for emerging researchers in the field.
Speaking after receiving the award, O’Brien described it as a shared achievement, acknowledging the importance of global collaboration in accelerating innovation and transforming early-stage ideas into real-world technologies.
William Scanlon, CEO of Tyndall, praised O’Brien’s leadership, noting that his work has positioned the institute at the forefront of advanced packaging and is helping to shape Europe’s semiconductor future.
At the same ceremony, Eric Beyne of IMEC received the Special Service Award for his contributions to high-density interconnection and next-generation semiconductor integration technologies.
SEMI Europe President Laith Altimime said both awardees exemplify the innovation, collaboration and leadership driving the industry forward.
The recognition comes during a period of strong momentum for Tyndall, which recently announced a €100 million expansion to further enhance its research capabilities.
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