Prime Minister Launches HCL-Foxconn’s Semiconductor Fab.
PM addressing during the groundbreaking ceremony for the HCL-Foxconn…..
India has taken a significant step toward strengthening its semiconductor capabilities, as Prime Minister Narendra Modi laid the foundation stone for India Chip Pvt Ltd — a joint venture between HCL Group and Taiwan’s Foxconn. The outsourced semiconductor assembly and test (OSAT) facility will be developed in Greater Noida and is expected to be operational by 2028.
The foundation ceremony, attended virtually by the Prime Minister on February 21, 2026, marks a major milestone in India’s drive for technological self-reliance. The project is structured as a 60:40 partnership between HCL and Foxconn and involves an investment of ₹37 billion.
Located within the Yamuna Expressway Industrial Development Authority (YEIDA) region, the facility will focus on the production of display driver chips. It is designed to handle up to 20,000 wafers per month and is expected to generate more than 3,500 direct and indirect jobs. Beyond employment, the project aims to strengthen India’s domestic semiconductor supply chain and attract additional partners across the value chain.
The initiative forms part of the India Semiconductor Mission (ISM), under which ten fabrication and packaging projects have already been approved, with four nearing production.
In his remarks, Prime Minister Modi described semiconductor manufacturing as a catalyst for broader innovation, driving the growth of design centres, start-ups and advanced research ecosystems. He characterised the current decade as a “tech-ade” for India, underscoring technology as a cornerstone of national strength in the 21st century.
He also referenced the recent Global AI Impact Summit in New Delhi, noting international recognition of India’s growing leadership in artificial intelligence and reaffirming that the country’s technological progress continues to accelerate.
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