$12 billion Expansion for Amkor Arizona..
Amkor Technology expands Arizona semiconductor campus to $12 billion with Phase 2
Amkor Technology is planning a second phase for its advanced semiconductor packaging and test campus in Arizona, adding about 60,000 square meters of cleanroom capacity and bringing total planned investment in the project to approximately $12 billion.
The company announced Phase 2 on September 8, 2026, after customer commitments exceeded the 33,000 square meters of cleanroom capacity initially planned for Phase 1. Once complete, the campus will offer roughly 93,000 square meters of cleanroom capacity.
Amkor is developing the campus in multiple phases to meet growing U.S. demand for advanced packaging and test services. The site will include wafer bumping, probing, assembly and testing, creating a turnkey domestic manufacturing platform for advanced semiconductor devices.
Construction of Phase 2 is expected to begin late in 2027, with completion scheduled for the end of 2029. Across Phase 1 and Phase 2, the campus is expected to employ more than 3,500 Arizona-based workers.
Amkor president and CEO Kevin Engel said the next phase reflects customer confidence in Amkor and the increasing significance of advanced packaging in semiconductor manufacturing.
The roughly 170-acre campus has been laid out to allow further capacity expansion based on customer requirements. In May 2026, Amkor acquired 67 additional acres adjoining its existing 104-acre site, taking the total to about 171 acres.
In June 2026, Amkor and TSMC signed a 10-year agreement under which TSMC will purchase advanced packaging and test services from Amkor to serve demand for high-performance computing, artificial intelligence and advanced electronics devices.
Construction of the first manufacturing facility is underway, with foundation work advancing towards steel erection. Phase 1 remains on target for completion in 2027.
Amkor has guided to capital expenditure of roughly $2.5 billion to $3 billion in 2026, a substantial share of which is directed at the Arizona campus.
The project is positioned as complementary to front-end wafer fabrication already established in Arizona, linking wafer fabrication with advanced packaging and testing inside the U.S. semiconductor value chain.
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